Aidan Lee, failure analysis development engineer at Intel Corporation, will visit campus to discuss the complex world of computer chip manufacturing.

Within the computer that you are using to view this abstract lies a microchip, roughly the size of a fingernail, yet it houses billions of transistors. The process of creating such a device, with its billions of nanometer-sized structures, stands as a pinnacle of technological advancement, representing the culmination of decades of innovation in physics, chemistry, and engineering. In this talk, I will begin by detailing the steps required to fabricate a much simpler device that is commonly used in physics experiments. This example will serve as an introduction to the complex world of chip manufacturing, highlighting key techniques such as photolithography, etching and thin film deposition. These foundational methods are the essential building blocks of semiconductor fabrication, enabling the precise manipulation of materials at the nanoscale.

Join us on Friday, Apr. 5, for this exciting presentation from Lee. Lunch will be available in Hayes 216 from 11:45 a.m. to 12:15 p.m. and the presentation will begin in Hayes 211/213 at 12:10 p.m. We hope to see you there!